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Current Position:Home >> >> Products
automotive front panel
Technology: OSP
layers: 2layer
Industrial
Technology: HAL
layers: 8layer
Single layer
Technology: OSP
layers: 2layer
Automotive front panel
Technology: HAL
layers: 2layer
Industry Main Board
Technology: OSP
layers: 2layer
Industrial
Technology: Immersion tin
layers: 2layer
Telecom
Technology: Gold connector
layers: 8layer
Industrial
Technology: Immersion silver
layers: 10-20layer
Industrial
Technology: Immersion silver
layers: 10-20layer
Industrial
Technology: Immersion gold
layers: 8layer
Industrial
Technology: Immersion gold
layers: 8layer
Industrial
Technology: Immersion gold
layers: 8layer
Industrial
Technology: Immersion gold
layers: 8layer
PCB Card
Technology: Immersion gold
layers: 6layer
Industrial Main Board
Technology: Immersion gold
layers: 6layer
Industry Equipment
Technology: Immersion gold
layers: 2layer
PCB with Punch Process
Technology: Immersion gold
layers: 2layer
Industrial
Technology: HAL Lead free
layers: 8layer
Industry Equipment
Technology: HAL Lead free
layers: 2layer
Connector
Technology: HAL Lead free
layers: 4layer
Industry Equipment
Technology: HAL Lead free
layers: 4layer

Products

automotive front panel
Technology: OSP
layers: 2layer
Industrial
Technology: HAL
layers: 8layer
Single layer
Technology: OSP
layers: 2layer
Automotive front panel
Technology: HAL
layers: 2layer
Industry Main Board
Technology: OSP
layers: 2layer
Industrial
Technology: Immersion tin
layers: 2layer
Telecom
Technology: Gold connector
layers: 8layer
Industrial
Technology: Immersion silver
layers: 10-20layer
Industrial
Technology: Immersion silver
layers: 10-20layer
Industrial
Technology: Immersion gold
layers: 8layer
Industrial
Technology: Immersion gold
layers: 8layer
Industrial
Technology: Immersion gold
layers: 8layer
Industrial
Technology: Immersion gold
layers: 8layer
PCB Card
Technology: Immersion gold
layers: 6layer
Industrial Main Board
Technology: Immersion gold
layers: 6layer
Industry Equipment
Technology: Immersion gold
layers: 2layer
PCB with Punch Process
Technology: Immersion gold
layers: 2layer
Industrial
Technology: HAL Lead free
layers: 8layer
Industry Equipment
Technology: HAL Lead free
layers: 2layer
Connector
Technology: HAL Lead free
layers: 4layer
Industry Equipment
Technology: HAL Lead free
layers: 4layer
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